Amplifier PCB

1) Amplifier PCB 2) Material: FR-4, 2OZ, 2.0mm 3) Min hole: 0.2mm 4) Min line width/space: 0.2mm/0.2mm

Amplifier PCB

1,base material:FR-4 epoxy resin

2,cooper thickness:1/2OZ   1OZ  2OZ  3OZ(17um 35um 70um 105um)

3,board thickness:0.2-3.2mm4,min.hole size:0.2mm5,min.line width/spacing:0.1mm

6,surface finishing:HASL/lead-free HASL

7,form:punching,routing,v-cut,beveling

Reference - Our Production Capability for Rigid PCB:

 

NO	Item	Craft Capacity
1	Layer	1-30 Layers
2	Base Material for PCB	FR4, CEM-1, TACONIC, Aluminium, High Tg MaterialHigh FrequenceROGERS ,TEFLON, ARLON, Halogen-free Material
3	Rang of finish baords Thickness	0.21-7.0mm
4	Max size of finish board	900MM*900MM
5	Minimum Linewidth	3mil (0.075mm)
6	Minimum Line space	3mil (0.075mm)
7	Min space between pad to pad	3mil (0.075mm)
8	Minimum hole diameter	0.10 mm
9	Min bonding pad diameter	10mil
10	Max proportion of drilling hole and board thickness	1:12.5
11	Minimum linewidth of Idents	4mil
12	Min Height of Idents	25mil
13	Finishing Treatment	HASL (Tin-Lead Free),  ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.
14	Soldermask	Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask.
15	Minimun thickness of soldermask	10um
16	Color of silk-screen	White, Black, Yellow ect.
17	E-Testing	100% E-Testing (High Voltage Testing);  Flying Probe Testing
18	Other test	ImpedanceTesting,Resistance Testing, Microsection etc.,
19	Date file format	GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++
20	Special technological requirement	Blind & Buried Vias and High Thickness copper
21	Thickness of Copper	0.5-14oz (18-490um)

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Amplifier PCB